Just been informed that JCPA advices fast cooling rates after reflow—WRONG.
That has no benefit for solder joint reliability and sets up large T-gradients causing problems with thermal expansion mismatches.
Everybody (!) check your cooling rates—H-P has mandated no more than 1.5°C/sec for good reason.
Werner
-----Original Message-----
From: pearl petras <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Feb 2, 2010 5:13 pm
Subject: [TN] track lifting
While we wait for IPC to set up a picture site, could I impose on Steve to post
another picture?
Any comments as to what could possibly be the root causes of this is much
appreciated.
Thanks so much
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