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February 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 2 Feb 2010 21:40:35 -0500
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IngeMar, did you check the reflow instruction from the vendor?  Some of them may not be leadfree.  

--------------------------

Sent using BlackBerry





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Tue Feb 02 20:49:19 2010

Subject: Re: [TN] track lifting



It would be helpful to know the size of the device, I/O count,  pitch and 

the location of the "lifts" (corner or edge) and the specifics of  the 

substrates, package and mounting along with process specifics for  starters. Also 

is this a one time event or a recurring one?  Right now it is just a 

curiosity  

 

As Werner has alluded with his comment that the picture is "less than  

illuminating", it seems there are still "other shoes still need to drop".

 

Kind regards, 

Joe 

 

 

In a message dated 2/2/2010 5:13:11 P.M. Pacific Standard Time,  

[log in to unmask] writes:



Hi Steve  & All,

A 'mechanical hit' would not cause this.  While the pic is  less than fully 

illuminating, I have seen similar 'buckle ups' with Pb-free  

solders/soldering before.

We need to remember, that SAC is 40% stiffer than  SnPb, has a higher yield 

strength and creeps about a factor of 50 slower—it  thus, becomes a 

mechanically significant layer with a higher CTE than Cu and  the PCB(x,y).



Werner

















-----Original  Message-----

From: Steve Gregory <[log in to unmask]>

To:  [log in to unmask]

Sent: Tue, Feb 2, 2010 6:10 pm

Subject: Re: [TN] track  lifting





Hi Pearl,



Here's your  picture:



http://stevezeva.homestead.com/files/Track_Lifting.JPG



What  I see in the picture is that BGA (it is a BGA isn't it?) was  almost

ripped-off the board somehow. 



The traces are stretched and  the soldermask has been torn up from the 

board.

The root cause is that  something mechanically hit the BGA and ripped up 

pads

and traces. Is there  any other marks on the BGA?



Steve



-----Original  Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of pearl  petras

Sent: Tuesday, February 02, 2010 5:13 PM

To:  [log in to unmask]

Subject: [TN] track lifting



While we wait for IPC to  set up a picture site, could I impose on Steve to

post another  picture?

Any comments as to what could possibly be the root causes of this  is much

appreciated.  



Thanks so much





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