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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Fri, 26 Feb 2010 15:26:09 -0500
Content-Type:
text/plain
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text/plain (107 lines)
 Hi Inge,
D38/US33—no way.
What about Sweden—are you guys getting fat and happy?
Werner

 


 

 

-----Original Message-----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Tue, Feb 9, 2010 3:36 pm
Subject: Re: [TN] IMC


Werner, 
what intermedals are formed in Vancouver? USA and Germany > US32/D26 and finally D38/US33?
/Inge
  
----- Original Message ----- 
  
From:   Werner   Engelmaier 
  
To: [log in to unmask] ; [log in to unmask] 
  
Sent: Friday, February 26, 2010 10:46   AM
  
Subject: Re: [TN] IMC
  


  
Hi Inge,
No,   they form some nice crystalline plateletts, just like AgSn and AuSn-IMCs and   just like them lead to solder embrittlement in sufficient concentration. I   will be publishing a column on it in Global SMT & Packaging in about May   or June.
Werner

  


  
  


  


  
-----Original   Message-----
From: Inge <[log in to unmask]>
To:   Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Fri, Feb 26, 2010   1:36 pm
Subject: Re: [TN] IMC

  
Hi, did not know of   Tin/Palladium IMC. Thought they formed an   alloy. 
/Inge 
 
-------------------------------------------------- 
From:   "Werner Engelmaier" <[log in to unmask]> 
Sent: den   26 February 2010 07:50 
To: <[log in to unmask]> 
Subject: [TN]   IMC 
 
> Hi all, 
> What are the intermetallic   compounds formed between Sn and Pd? 
>   Werner 
> 
> 
> 
> 
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