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February 2010

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Thu, 25 Feb 2010 10:47:35 -0800
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text/plain
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text/plain (65 lines)
Gregg,

  How thick is the PCA?

Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Temkin, Gregg
Sent: Thursday, February 25, 2010 9:22 AM
To: [log in to unmask]
Subject: [TN] Are open vias in underfill area a problem?

Are there any concerns with .008" dia vias beneath a BGA requiring underfill?  Would these holes be sufficiently small to prevent "leakage" to the other side of the PWB?  The underfill material used will be Loctite 3563.  I don't care if the vias fill, just don't want material draining out the other side.

Thanks,

Gregg

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