Subject: | |
From: | |
Reply To: | |
Date: | Thu, 25 Feb 2010 11:37:26 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Gregg - it depends on the specific underfill product you are using.
Some underfills like to stay put and some underfills love to run thru the
vias. And covering the vias with kapton tape can actually make things
worst instead of acting like a dam. I recommend you run a quick test to
assess the potential issue.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Temkin, Gregg" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/25/2010 11:22 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Temkin, Gregg" <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Are open vias in underfill area a problem?
Are there any concerns with .008" dia vias beneath a BGA requiring
underfill? Would these holes be sufficiently small to prevent "leakage"
to the other side of the PWB? The underfill material used will be Loctite
3563. I don't care if the vias fill, just don't want material draining
out the other side.
Thanks,
Gregg
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|