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February 2010

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Subject:
Re: Removal of Solder Mask from CU pads
From:
stephengregory5849 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, stephengregory5849 <[log in to unmask]>
Date:
Tue, 23 Feb 2010 23:08:50 -0500
Content-Type:
text/plain
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On bare boards that might be fine, but I would be cautious about using 
baking soda as a media on loaded boards, lots and lots of static is 
generated.

Steve

----- Original Message ----- 
From: "Julie Silk" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, February 23, 2010 12:50 PM
Subject: Re: [TN] Removal of Solder Mask from CU pads


We've used a micro-sandblaster and baking soda.  The baking soda is hard
enough to go through the epoxy, but soft enough not to damage the copper.
Some care is needed.  Then you can wash off the baking soda.

Julie Silk
Agilent Technologies

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