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February 2010

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Mon, 22 Feb 2010 14:59:40 -0500
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Hi Chester,

I've had to remove mask from SMT pads before, and the only way I could find
to do it was with the very careful use of an exacto knife and dremel tool. I
remember people saying that Lasers are effective. 

PTH pads are another story I think that would be pretty tricky with an
exacto knife.  Do know if any mask got down inside the holes?

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Harner, Chester
Sent: Monday, February 22, 2010 2:14 PM
To: [log in to unmask]
Subject: [TN] Removal of Solder Mask from CU pads

IPC7711 provides methods for removal of "Conformal Coating" and epoxy
coating is included in the discussion. However, could it apply to the
removal of epoxy solder mask?

 

I have some boards that made it into pick and place with a few SMT pads
covered with solder mask, and four through hole components with no
solder mask openings around the pads. It wasn't discovered till the SMT
parts (0603 caps) fell off the assembly and the through hole diodes
would not solder.

 

The Question - Is there a way to remove the solder mask from the pads
and still meet IPC-600/610 requirements.

 

Chet Harner   Sr. Engineer   Crane Hydro-AirePO Box 7722 Burbank Ca -
91510  818-526-2600 x3557

 


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