Joyce,

Good point!


On a much different topic [definitely OFF-TechNet].  

Would you ever see a need/desire for outside wirebond applications or
development work?  This enterprise could assist in package layout, platings,
prototypes, or just 'seeing if it worked' from a bondability point of view.


Would much rather get in and quantify an optimized bond schedule for
someone, but realize that transfer of a schedule from machine to machine
[let alone differing brands and bonding tools] is likely doomed to failure.

Trying to leverage my skills in wire, beamlead, tab and flipchip bonding as
a way to do what I like to do, and make enough money to pay some bills as
well.

Would take getting very close to a limited number of entities to be able to
take off.  Equipment selection/versatility would be a very interesting
challenge, as would defining a cost schedule.

Just wanted to bounce the idea off you and see what you thought. Very much
in the formative stages at the moment.

Appreciate any thoughts that might pop into your head throughout the course
of the next week or so

Sincerely,

Steven Creswick

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