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February 2010

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Tue, 16 Feb 2010 15:46:49 -0500
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Joe

I have made similar measurements using spark plug gap gauge. I am not sure it will work in this case since I do not know haw accessible the board is at the time you want to make the measurement.

Best regards
Lee
J. L. Parker Ph. D.
JLP Consultants LLC
804 779 3389 
  ----- Original Message ----- 
  From: Joe Macko<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Tuesday, February 16, 2010 3:34 PM
  Subject: [TN] Best way to measure "actual" themal pad compression


  All,

   

  I am looking for some proven ways to measure the actual air gap (e.g., 5
  to 30 mils) between a component and its mating thermal pad pedestal
  located on a Chassis without cutting up the hardware so I can determine
  the actual thermal pad compression once a pad is installed.  Using a
  model, the theoretical gap can be calculated but I would like to
  empirically measure/verify what the gap is and the subsequent pad
  compression.  Visually, it is hard to tell and not all locations are
  visible and, I do not have access to any hardware to cut up, etc.. so I
  am looking for a tried and proven method. Some have suggested using a
  soft material like putty that will compress and could then be
  subsequently measured after disassembly. I have heard rumors of material
  designed for this purpose but are unable to find such material.  thx

   

  Best Regards,

  -Joe M.

   


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