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February 2010

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Subject:
From:
Joe Macko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 16 Feb 2010 12:34:14 -0800
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text/plain
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All,

 

I am looking for some proven ways to measure the actual air gap (e.g., 5
to 30 mils) between a component and its mating thermal pad pedestal
located on a Chassis without cutting up the hardware so I can determine
the actual thermal pad compression once a pad is installed.  Using a
model, the theoretical gap can be calculated but I would like to
empirically measure/verify what the gap is and the subsequent pad
compression.  Visually, it is hard to tell and not all locations are
visible and, I do not have access to any hardware to cut up, etc.. so I
am looking for a tried and proven method. Some have suggested using a
soft material like putty that will compress and could then be
subsequently measured after disassembly. I have heard rumors of material
designed for this purpose but are unable to find such material.  thx

 

Best Regards,

-Joe M.

 


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