Hi all,
We buy ordinary Tin/Lead-balled BGAs from XILINX. Now, in the Xray inspection after soldering, we can often see, that some out of 600 balls are not as sround as aspected to be. Instead, some balls are deformed. Not much, but enough to start questions whether such balls are accepted or not. Have not seen anything about roundness requirements in any norm. A deformed ball can tell you about possible electrical issues or about lowering the mechanical fatigue life. On the other hand, irregular ball shape may mean nothing. If the electrical connection is free from failure, one may neglect the unshape.
The boards are VP soldered. Have any idea if VP is part of our problem?
A typical example is a multilayer board, size about 8x10 inches, populated with five BGA560s. The total of 'deformed' balls numbers some ten pcs. We have had discussions for weeks without coming to a decision if such balls are okay or not. There are no indications of electrical issues (yet.
What is your opinion?
/Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: tisdag 16 februari 2010 01:51
To: [log in to unmask]
Subject: Re: [TN] Pre-Tinned BGA?
Thanks Bob,
Didn't know about 2 great suppliers left.
Werner
-----Original Message-----
From: Bob Landman <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, Feb 15, 2010 7:37 pm
Subject: Re: [TN] Pre-Tinned BGA?
Hi Werner,
Well, Lattice Semiconductor (bless them!) still offers Pb/Sn balls on BGAs and PLDs and so does Analog Devices (bless them too!).
Others may be more problematic hence we prefer Lattice products for their features and their support. They are ideal for small companies like ours. Their design tools are very affordable compared to others. Every year their tools get better.
Bob Landman
H&L Instruments, LLC
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Monday, February 15, 2010 7:18 PM
To: [log in to unmask]
Subject: Re: [TN] Pre-Tinned BGA?
Hi Joyce,
where have u been--sure (3) is ideal, but where do you get the components from?
Werner
-----Original Message-----
From: Joyce Koo <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, Feb 15, 2010 6:30 pm
Subject: Re: [TN] Pre-Tinned BGA?
(3) And (1). But not the other. (3) required nothing to be done on the assembly level. All the rel data are valid. (1) may need reduced rel qual. The others, as material change, most of the mil or hi rel house need full qual (shake, drop all the nine yard). It would cost around 30 to 50k plus risk budget (depend upon how complicated is your assembly) and 3 month delay. At least it use to be. My ancient 1.8 cents.
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Mon Feb 15 17:49:57 2010
Subject: [TN] Pre-Tinned BGA?
Hello All,
I had a question to see if anyone has tried anything different. Most of our customers are some how related to the military. So we have one product that the customer just found out was a PB-Free device. They want us to "pre-tin" the spheres. Now I have tried several process for forward and backward processes.
None of them include re-tinning of a BGA Device. We do re-tin other leaded and some non leaded devices. So below are the three options I have recommended but still have reliability concerns as the end product is to be coated with Paralyne.
1. Re- Ball to PB/SN
2. Sue a selective rework machine and place pate with isolated heat if the substraight could handle.
3. Purchase the component in PB/SN material 4. Reflow the product with slightly higher temps (5c per 10 zones) once out of over and cold to room temp underfil the device.
Again if anyone has any more ideas I am game!!
Carl Ray
Lewisburg TN 37091
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