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February 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Mon, 15 Feb 2010 18:30:40 -0500
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(3) And (1). But not the other. (3) required nothing to be done on the assembly level.  All the rel data are valid.  (1) may need reduced rel qual.  The others, as material change, most of the mil or hi rel house need full qual (shake, drop all the nine yard).  It would cost around 30 to 50k plus risk budget (depend upon how complicated is your assembly) and 3 month delay.  At least it use to be. My ancient 1.8 cents. 
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Mon Feb 15 17:49:57 2010
Subject: [TN] Pre-Tinned BGA?

Hello All,
 I had a question to see if anyone has tried anything different. Most of our customers are some how related to the military. So we have one product that the customer just found out was a PB-Free device. They want us to "pre-tin" the spheres. Now I have tried several process for forward and backward processes. None of them include re-tinning of a BGA Device. We do re-tin other leaded and some non leaded devices. So below are the three options I have recommended but still have reliability concerns as the end product is to be coated with Paralyne.
1. Re- Ball to PB/SN
2. Sue a selective rework machine and place pate with isolated heat if the substraight could handle.
3. Purchase the component in PB/SN material
4. Reflow the product with slightly higher temps (5c per 10 zones) once out of over and cold to room temp underfil the device.

Again if anyone has any more ideas I am game!!


Carl Ray
Lewisburg TN 37091

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