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February 2010

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Subject:
From:
Carl Ray <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Carl Ray <[log in to unmask]>
Date:
Mon, 15 Feb 2010 14:49:57 -0800
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Hello All,
 I had a question to see if anyone has tried anything different. Most of our customers are some how related to the military. So we have one product that the customer just found out was a PB-Free device. They want us to "pre-tin" the spheres. Now I have tried several process for forward and backward processes. None of them include re-tinning of a BGA Device. We do re-tin other leaded and some non leaded devices. So below are the three options I have recommended but still have reliability concerns as the end product is to be coated with Paralyne.
1. Re- Ball to PB/SN
2. Sue a selective rework machine and place pate with isolated heat if the substraight could handle.
3. Purchase the component in PB/SN material
4. Reflow the product with slightly higher temps (5c per 10 zones) once out of over and cold to room temp underfil the device.

Again if anyone has any more ideas I am game!!


Carl Ray
Lewisburg TN 37091

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