Dear Technos,

 

I know the ImAg has been discussed over and over and with the same results, very good and reliable finish.

 

My little something now is all the proponents were mainly in high-rel applications (so SnPb solder most likely) and I do not remember if RoHS on Ag was discussed. I know it wouldn't make sense for this finish not to work with SAC305 pastes, but I just want to make sure.

 

 We have, guess what, wetting issues on two different boards, from the same supplier. We have tried playing with the reflow recipe, no improvement. The batch finished, but now we are attacking a few more different models 

from the same PCB fab.

 

So, did anybody have issues with ImAg because they were on lead-free? Any particular parameters that are not a happy ingredient, like specific types of paste, specific solder recipe milestones?

 

If it were the PCBs, what could be wrong except for the Ag thickness? I mean XRF analysis would be cheaper than x-sectioning...

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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