Chris,
I agree with Vald that this last picture looks like it was caused by the sectioning process...
My guess is you need to use either a resinoid blade or a diamond blade with sub micron particles in it... the chipping would occur when metal diamond blade goes from the Si to the plastic material where the and the blade deflects a few tenths of a micron....
Try speeding up the blade, going with lower feed rates and flood the coolant...but mostly change the particulate size in the blade...
Check the Si with a chemical etch and look for the pit orientation along the areas adjacent to the cracks...
Paul
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Friday, February 12, 2010 11:59 AM
To: [log in to unmask]
Subject: Re: [TN] Die cracks
Hi Vlad,
Thanks
Trust me, this is what we want the answer to be. And yes we do approach with 180 or 320. But why do we see it in only 0.1% of our BGA sections? And is it our process that grouped the observations with these samples?
And, just to be clear, do you know the signature?
We know the edge grinding damage signature:
https://robisan.sharefile.com/d-s441418b99d34882b
Chris
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Friday, February 12, 2010 2:18 PM
To: [log in to unmask]
Subject: Re: [TN] Die cracks
Chiris,
99.999999% the cracks are due to the sample preparation. Most
probably, the die was approached (touched) with a low drig SiC paper
(like 180),
--
Best regards,
Vladimir mailto:[log in to unmask]
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
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