Hi TN

We are in desperate need of QUICK expertise and/or opinions wrt the die cracks that can be seen from the links below.  Sorry Steve, didn't want to circumvent you but I've got to come up with an opinion by EOD.  BGA/CSPs were encapsulated in slow cure epoxy prior to excision.  We section BGAs everyday and rarely see die cracks.
I've got to decide whether we should recommend that the CM build up a few more for NDT (acoustics, CT..)

I know: max cool-down was probably 2.2-2.8C/ second; ICT was not strain engineered or tested;  SAC305 balls, paste; parts passed ICT, ..but cracks don't look to reach active circuitry
Don't know: laminate, peak reflow
Can't say: pretty much anything else

Thanks!
Chris

https://robisan.sharefile.com/d-s7b37c04078d4889b
https://robisan.sharefile.com/d-sc19f7716a0645489
https://robisan.sharefile.com/d-sb215d22cbf54972b
https://robisan.sharefile.com/d-s22d269ff34d4018a






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