Hi Werner
Modern VP are very different from those we used in the far e ’80ties, when CFC medium were allowed.
VP Technology is improved a lot and really is helping to the health of certain SMDs reflowed by high L-F reflow soldering temperature.
Today you can select the medium with boiling point according to your needs.
As John says, the 3 major manufacturers of such equipment are within a 20 minute drive of each other, all in southern Germany (same “pivovar” :-)
If you have time, and not already done, go through the descriptions available on the web, you’ll find very interesting infos.
IBL
http://www.ibl-loettechnik.de/index.html
ASSCON (Vacuum Option available for voidfree soldering)
http://asscon.de/
REHM (Vacuum Option available for voidfree soldering )
http://www.rehm-group.com
http://www.rehm-group.com/index.php?module=Pagesetter&func=viewpub&tid=16&pid=21&mnid=3_0_2
I agree with Graham, at the moment REHM is one step ahead compared others, the CONDENSO ( models: XM, XP, XP HS, is really a very interesting technology). Several options are available.
At Productronica '09 I have seen Rehm presentation, about the new option available like plasma cleaning embedded in same Condenso system.
a peace of CONDENSO explanation..
– TA defined quantity of an inert fluid (usually perfluorpolyether ao called Galden) is vaporized during reflow soldering in the process chamber, which is hermetically sealed by means of a bulkhead. The vapor allows for extremely effective heat transfer to the PCBs due to the release of heat during condensation, and the temperature of the medium remains constant. In addition to this, the medium’s boiling point limits the maximum soldering temperature so that the PCBs cannot be damaged due to overheating. This, as well as the ability to control the volume of injected liquid and intermediate exhaust of the vapor, also makes it possible to precisely adjust the temperature/reflow profile of the PCB.
At the end of the soldering process the hot gas in the process chamber will be temporarily removed, cooled down via heat transformers and again fed back into the chamber. This procedure ensures a temperature below the “liquidus temperature” already in the chamber the soldering process is completed and ready to start.
In EU several minor VP manufactures are available, they offer small equipment even bench-top type, very helpfull also for BGA reballing.
With L-F the VP tech, is living his second life.
Regards
Gabriel
-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Werner Engelmaier
Inviato: sabato 6 febbraio 2010 0.39
A: [log in to unmask]
Oggetto: Re: [TN] Vapor Phase soldering
Hi Graham
I am looking for info on what is available to make recommendations to clients. It is becoming more and more clear, that in order to avoid a manner of problems caused by Pb-free soldering temperatures, the best option is to solder with the lowest possible temperature, and that means using vapor phase.
Werner
-----Original Message-----
From: Graham Naisbitt <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Fri, Feb 5, 2010 5:45 pm
Subject: Re: [TN] Vapor Phase soldering
Hi Werner
Can you be more specific?
The best VP system that I know, is now available from REHM and based upon the
patents of J-P Garridel (France). This employs a discontinuous conveyorised
system that minimises solvent losses.
Might this be what you are seeking information about?
Regards
Graham Naisbitt - KBO
Email: [log in to unmask]
Phone: +44 (0)12 5252 1500
Web: www.gen3systems.com
On 5 Feb 2010, at 08:48, Werner Engelmaier wrote:
> Hi All,
> I would appreciate any feedback on the new vapor phase soldering ovens that
have recently become available.
> Werner
>
>
>
>
>
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