Bob,
Yes, a tad difficult when you are building thousands, tens of thousands and
hundreds of thousands within a short time span.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Landman
Sent: Saturday, February 06, 2010 1:22 AM
To: [log in to unmask]
Subject: Re: [TN] Vapor Phase soldering

Bev

I would have thought you'd put the shields on after reflow.  So you  
put the chips down and then place the shields and reflow them both at  
the same time

We use clips and put the shields on after reflow on our fiberoptic  
receivers.

Of course we don't come near the volume you do at RIM.

Bob Landman
H&L Instruments, LLC

Sent from my iPhone

On Feb 5, 2010, at 10:12 PM, Bev Christian <[log in to unmask]> wrote:

> Werner,
>
> Oh the machines are hermetic, but most RF can are not - they have  
> holes
> through them.  So the fluids condense inside the RF can enclosure and
> even if you leave circuit packs in the oven for hours on end,  you  
> can't
> get the stuff out from inside the cans, so when you take the boards
> outside the oven, you lose the $$$$ fluid.
>
> Bev
>
>
>
> From: Werner Engelmaier [mailto:[log in to unmask]]
> Sent: Friday, February 05, 2010 10:09 PM
> To: [log in to unmask]; Bev Christian
> Subject: Re: [TN] Vapor Phase soldering
>
>
>
> Bev,
> Is that with any of the new machines? This would be discouraging. I
> thought these new machines are pretty hermetic.
> Werner
>
>
>
>
>
>
>
> -----Original Message-----
> From: Bev Christian <[log in to unmask]>
> To: [log in to unmask]
> Sent: Fri, Feb 5, 2010 8:43 pm
> Subject: Re: [TN] Vapor Phase soldering
>
> We've given up on vapor phase. The liquid condenses inside the RF  
> cans.
> Too $ to
>
>
>
>
> let evaporate outside the oven. And even if the GWP is "only"  
> something
> less
>
>
>
>
> than 100, still too high for me.
>
>
>
>
> Bev
>
>
>
>
> RIM
>
>
>
>
>
>
>
>
>
> ----- Original Message -----
>
>
>
>
> From: TechNet <[log in to unmask]>
>
>
>
>
> To: [log in to unmask] <[log in to unmask]>
>
>
>
>
> Sent: Fri Feb 05 18:38:37 2010
>
>
>
>
> Subject: Re: [TN] Vapor Phase soldering
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Hi Graham
>
>
>
>
> I am looking for info on what is available to make recommendations to
> clients.
>
>
>
>
> It is becoming more and more clear, that in order to avoid a manner of
> problems
>
>
>
>
> caused by Pb-free soldering temperatures, the best option is to solder
> with the
>
>
>
>
> lowest possible temperature, and that means using vapor phase.
>
>
>
>
> Werner
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> -----Original Message-----
>
>
>
>
> From: Graham Naisbitt <[log in to unmask]>
>
>
>
>
> To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier
>
>
>
>
> <[log in to unmask]>
>
>
>
>
> Sent: Fri, Feb 5, 2010 5:45 pm
>
>
>
>
> Subject: Re: [TN] Vapor Phase soldering
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Hi Werner
>
>
>
>
>
>
>
>
>
> Can you be more specific?
>
>
>
>
>
>
>
>
>
> The best VP system that I know, is now available from REHM and based
> upon the
>
>
>
>
> patents of J-P Garridel (France). This employs a discontinuous
> conveyorised
>
>
>
>
> system that minimises solvent losses.
>
>
>
>
>
>
>
>
>
> Might this be what you are seeking information about?
>
>
>
>
>
>
>
>
>
> Regards
>
>
>
>
>
>
>
>
>
> Graham Naisbitt - KBO
>
>
>
>
>
>
>
>
>
> Email: [log in to unmask]
>
>
>
>
> Phone: +44 (0)12 5252 1500
>
>
>
>
> Web: www.gen3systems.com
>
>
>
>
>
>
>
>
>
> On 5 Feb 2010, at 08:48, Werner Engelmaier wrote:
>
>
>
>
>
>
>
>
>
>> Hi All,
>
>
>
>
>> I would appreciate any feedback on the new vapor phase soldering  
>> ovens
> that
>
>
>
>
> have recently become available.
>
>
>
>
>> Werner
>
>
>
>
>>
>
>
>
>
>>
>
>
>
>
>>
>
>
>
>
>>
>
>
>
>
>>
>
>
>
>
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