My assembler wrote Werner:

Hello Werner,

Last fall we purchased a IBL SLC504 Vapor Phase reflow machine.  So  
far we are very happy with the machine.  We are using it for Tin/Lead  
and Lead free SAC305 soldering.

We are using Galden HS235 as the fluid, which means that the maximum  
temperature any part on the board sees is 235 degrees C.  We do the  
Tin/Lead soldering at 210 degrees C by keeping the board higher in the  
vapor zone.

The machine has a IR preheater but we find we do better in just the  
vapor.  IBL has a patented SVP soft vapor temperature rise software  
which our machine has, and which allows us to preheat the board in the  
vapor.  The SVP works very good for Lead free soldering since the  
vapor acts as an inert zone without having to use Nitrogen.

Our biggest problem was learning how setup the profiles so that we do  
not get tomestoning of the small chip parts.  It took a while but we  
now seem to have solved the problem.

We also have found that we must bake the bare PC boards before  
assembly so that there is no water vapor outgassing from the board.   
We also find that we need to bake some chip parts if they have on the  
shelf for awhile.  We use a low temperature with a 12 hour bake which  
helps with the tomestoning problem.  We are not de-reeling the parts  
for the bake.

The Lead free solder joints have less voids and the grain structure is  
much finer than the same board done in the convection reflow oven.










Sent from my iPhone

On Feb 6, 2010, at 1:22 AM, Bob Landman <[log in to unmask]>  
wrote:

> Bev
>
> I would have thought you'd put the shields on after reflow.  So you  
> put the chips down and then place the shields and reflow them both  
> at the same time
>
> We use clips and put the shields on after reflow on our fiberoptic  
> receivers.
>
> Of course we don't come near the volume you do at RIM.
>
> Bob Landman
> H&L Instruments, LLC
>
> Sent from my iPhone
>
> On Feb 5, 2010, at 10:12 PM, Bev Christian <[log in to unmask]> wrote:
>
>> Werner,
>>
>> Oh the machines are hermetic, but most RF can are not - they have  
>> holes
>> through them.  So the fluids condense inside the RF can enclosure and
>> even if you leave circuit packs in the oven for hours on end,  you  
>> can't
>> get the stuff out from inside the cans, so when you take the boards
>> outside the oven, you lose the $$$$ fluid.
>>
>> Bev
>>
>>
>>
>> From: Werner Engelmaier [mailto:[log in to unmask]]
>> Sent: Friday, February 05, 2010 10:09 PM
>> To: [log in to unmask]; Bev Christian
>> Subject: Re: [TN] Vapor Phase soldering
>>
>>
>>
>> Bev,
>> Is that with any of the new machines? This would be discouraging. I
>> thought these new machines are pretty hermetic.
>> Werner
>>
>>
>>
>>
>>
>>
>>
>> -----Original Message-----
>> From: Bev Christian <[log in to unmask]>
>> To: [log in to unmask]
>> Sent: Fri, Feb 5, 2010 8:43 pm
>> Subject: Re: [TN] Vapor Phase soldering
>>
>> We've given up on vapor phase. The liquid condenses inside the RF  
>> cans.
>> Too $ to
>>
>>
>>
>>
>> let evaporate outside the oven. And even if the GWP is "only"  
>> something
>> less
>>
>>
>>
>>
>> than 100, still too high for me.
>>
>>
>>
>>
>> Bev
>>
>>
>>
>>
>> RIM
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> ----- Original Message -----
>>
>>
>>
>>
>> From: TechNet <[log in to unmask]>
>>
>>
>>
>>
>> To: [log in to unmask] <[log in to unmask]>
>>
>>
>>
>>
>> Sent: Fri Feb 05 18:38:37 2010
>>
>>
>>
>>
>> Subject: Re: [TN] Vapor Phase soldering
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Hi Graham
>>
>>
>>
>>
>> I am looking for info on what is available to make recommendations to
>> clients.
>>
>>
>>
>>
>> It is becoming more and more clear, that in order to avoid a manner  
>> of
>> problems
>>
>>
>>
>>
>> caused by Pb-free soldering temperatures, the best option is to  
>> solder
>> with the
>>
>>
>>
>>
>> lowest possible temperature, and that means using vapor phase.
>>
>>
>>
>>
>> Werner
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> -----Original Message-----
>>
>>
>>
>>
>> From: Graham Naisbitt <[log in to unmask]>
>>
>>
>>
>>
>> To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier
>>
>>
>>
>>
>> <[log in to unmask]>
>>
>>
>>
>>
>> Sent: Fri, Feb 5, 2010 5:45 pm
>>
>>
>>
>>
>> Subject: Re: [TN] Vapor Phase soldering
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Hi Werner
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Can you be more specific?
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> The best VP system that I know, is now available from REHM and based
>> upon the
>>
>>
>>
>>
>> patents of J-P Garridel (France). This employs a discontinuous
>> conveyorised
>>
>>
>>
>>
>> system that minimises solvent losses.
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Might this be what you are seeking information about?
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Regards
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Graham Naisbitt - KBO
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Email: [log in to unmask]
>>
>>
>>
>>
>> Phone: +44 (0)12 5252 1500
>>
>>
>>
>>
>> Web: www.gen3systems.com
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> On 5 Feb 2010, at 08:48, Werner Engelmaier wrote:
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>> Hi All,
>>
>>
>>
>>
>>> I would appreciate any feedback on the new vapor phase soldering  
>>> ovens
>> that
>>
>>
>>
>>
>> have recently become available.
>>
>>
>>
>>
>>> Werner
>>
>>
>>
>>
>>>
>>
>>
>>
>>
>>>
>>
>>
>>
>>
>>>
>>
>>
>>
>>
>>>
>>
>>
>>
>>
>>>
>>
>>
>>
>>
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