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Date: | Mon, 8 Feb 2010 08:32:33 +0200 |
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The more the flux is 'cooked', the harder it is to remove. As you
apparently use a rosin-based flux, it may become very difficult. It is
not helpful to say you use an ultrasonic cleaner without telling us your
soldering time/temp profile, cleaning products and procedure, ultrasound
data etc.
I suggest you consult your flux manufacturer for advice on how HIS flux
residues may be best removed. For cleaning to wire-bonding standards,
you will probably have to go to more than a solvent, such as Vigon or
Kyzen products, if the flux maker cannot help.
There is no 'best' product.
Brian
jonathan noquil wrote:
> Hi All
> What is the best flux cleaning agent that can effectively remove flux on
> ENiAu bond pads?
> We solder a copper strap on the silicon with PbSn5 at 350 degc temperature,
> the flux contaminates the bonding pads.
> Paste is from Heraues. We used an ultrasonic cleaning equipment.
> During Au wirebonding, we have lots of bond off occurences? We tried to do
> FTIR on the surface and found some traces of that resin contamination.
>
> Is the flux difficult to remove with flux cleaning agent when it was
> reflowed at high temperature?
>
>
> Thanks
>
>
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