You have it right for most of the laser soldering systems on the market, except the best one. This was designed and developed by myself and Joshua Muonio and Gary Johnson of Analog Technologies, and we had an outside integrator build it for us. It resides at Analog, and they are getting ready to OEM the machine. This machine rotates up to 360 degrees around the object being lased, has programmable power, pulse length, movement while lasing (can be varied during individual or sets of laser steps), programmable focal spot size, and so many bells and whistles I don't have room here to mention them all.
Analog uses it for laser re-balling, original solder ball solder attachment, flex attachment, soldering of components that cannot withstand reflow temperatures, soldering of EMF shielding fences and cans, and many other applications. The machine can handle up to four energy sources simultaneously (for UV curing, Infrared preheating, and secondary lasers for marking or welding applications, for example).
We have used this machine to develop the best re-balling process possible, one that does not heat the component package by more than 1 deg. C during ball attachment.
Contact Analog about their laser re-balling and contract assembly services at www.analog-tech.com .
Read about laser re-balling here http://circuitsassembly.com/cms/magazine/209/7193 .
Not sure why you wish to use laser to solder a 15mm sq. BGA to the board. It can be done, but the laser has to be directed through the package.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Wednesday, February 03, 2010 2:50 PM
To: [log in to unmask]
Subject: Re: [TN] Laser soldering of BGA
Ioan,
In past years I spent some time looking at "Laser Soldering" and I had some
nice conversation with Beam Works folks at APEX shows.
Basically, in a nut shell, using a laser does not provide a lot more than
slightly focused IR.
If I have it wrong I hope someone can let me know!
Thanks,
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, February 03, 2010 2:35 PM
To: [log in to unmask]
Subject: [TN] Laser soldering of BGA
Dear Technos,
Any insights on BGA laser soldering? It is for soldering a 15x15 mm BGA onto
a flex PCB. The flex is backed by a rigid substrate in the BGA zone, but due
to mechanical constraints this substrate cannot be thicker than 0.012".
Oh yes, lead-free.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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