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| Date: | Wed, 13 Jan 2010 15:10:37 -0600 |
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Clean the boards and bake dry for 105 Deg. C for 20 minutes, then brush Alpha WS1208 tacky flux very lightly over the solder joints only, then run back through the reflow oven. But make sure there are no PTH components that cannot take the reflow temperature. Then wash, bake dry, and inspect. It should take care of about 90% of the graping.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, January 13, 2010 2:58 PM
To: [log in to unmask]
Subject: Re: [TN] Return of the "Snotballs"
I was hoping you could tell me.
The last time we were able to go back and touch the joints up because we
could touch every solder joint with an iron, but this time it's different.
We have a bunch of QFN's and BGA's on the board...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Randall L Bock
Sent: Wednesday, January 13, 2010 3:28 PM
To: [log in to unmask]
Subject: Re: [TN] Return of the "Snotballs"
and with a vengance.. wow what a mess... what do you do to fix it??
Randy Bock Sr.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of stephen gregory
Sent: Wednesday, January 13, 2010 3:24 PM
To: [log in to unmask]
Subject: [TN] Return of the "Snotballs"
Maybe some of you remember a post I made a couple of years ago when I was in
Tulsa and I had a reflow problem with a SAC solderpaste. It was then
I learned of a new term called "Snotballs". Here was the picture I posted
back then:
http://stevezeva.homestead.com/files/Snotballs.jpg
Well guess who decided to follow me out to Pennsylvania? Check out:
http://stevezeva.homestead.com/Type_4.JPG
Same vendor, same alloy.
All I can say is make sure you know where your powder is coming from.
Steve Gregory
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