Mumtaz,
One can not measure such thin layers (Au in particular) with SEM, unless the sample was specially prepared (overplated with Ni). Did you do that?
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Mumtaz Bora <[log in to unmask]>
Date: Wed, 13 Jan 2010 12:07:49
To: <[log in to unmask]>
Subject: Re: [TN] NiPdGold Plating Soldering Issues
Hi Victor,
Yes, I have SEM/EDX images of the component. SEM was used for plating
thickness measurements . Base material is copper. No idea on the dwell
time from Nickel to Gold.
Mumtaz Bora
Senior Quality Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
[log in to unmask]
SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference
and exhibition devoted to electronics assembly. Visit
www.smta.org/smtai for full details.
For a free exhibit pass:
http://smta.org/smtai/Free_Exhibits_Pass_SMTAI.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, January 13, 2010 6:49 AM
To: [log in to unmask]
Subject: Re: [TN] NiPdGold Plating Soldering Issues
Do you have SEM/EDX photos of this sample/cross section?
What instrument was used to measure the plating? XRF or SEM What is
base material?
Dwell time from nickel to Au plating?
Vic,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, January 12, 2010 6:23 PM
To: [log in to unmask]
Subject: Re: [TN] NiPdGold Plating Soldering Issues
Hi Mumtaz!
It's been a long while since anybody has asked me to post anything on my
webpage, TechNet has been pretty quiet for the last couple of months. I
have been pretty quiet myself for awhile. I've had a lot of changes in
my life recently.
Anyways, I have your PowerPoint posted, it's here:
http://stevezeva.homestead.com/Mumtaz.ppt
Sure looks like "head-in-pillow" to me.
Hope you have a good 2010.
Kind regards,
Steve Gregory
--- [log in to unmask] wrote:
From: Mumtaz Bora <[log in to unmask]>
To: [log in to unmask]
Subject: [TN] NiPdGold Plating Soldering Issues
Date: Tue, 12 Jan 2010 14:56:12 -0800
Hello Technetters,
We have some SC70 packages with NiPd gold plating that have wetting
issues .
Customer is using Kester R596L tinlead water soluble solder paste
conducting eutectic reflow at 227C peak and have wetting issues.(first
3 images in PowerPoint).
We have checked plating thickness with our supplier and it meets spec.
EDX did not show any contamination, oxides etc. JEDEC solderability test
passed.
X-section shows some areas of missing nickel or gaps in coverage of base
copper. I need the experts to look at the images and comment if this
could be the root cause of poor wetting and non-wetting.
I have forwarded the PowerPoint to Steven Gregory to post on his
website.
Your feedback will be much appreciated.
Thank-you
Mumtaz Bora
Senior Quality Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
[log in to unmask]
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