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| Date: | Wed, 13 Jan 2010 08:49:15 -0600 |
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Do you have SEM/EDX photos of this sample/cross section?
What instrument was used to measure the plating? XRF or SEM
What is base material?
Dwell time from nickel to Au plating?
Vic,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, January 12, 2010 6:23 PM
To: [log in to unmask]
Subject: Re: [TN] NiPdGold Plating Soldering Issues
Hi Mumtaz!
It's been a long while since anybody has asked me to post anything on my webpage, TechNet has been pretty quiet for the last couple of months. I have been pretty quiet myself for awhile. I've had a lot of changes in my life recently.
Anyways, I have your PowerPoint posted, it's here:
http://stevezeva.homestead.com/Mumtaz.ppt
Sure looks like "head-in-pillow" to me.
Hope you have a good 2010.
Kind regards,
Steve Gregory
--- [log in to unmask] wrote:
From: Mumtaz Bora <[log in to unmask]>
To: [log in to unmask]
Subject: [TN] NiPdGold Plating Soldering Issues
Date: Tue, 12 Jan 2010 14:56:12 -0800
Hello Technetters,
We have some SC70 packages with NiPd gold plating that have wetting
issues .
Customer is using Kester R596L tinlead water soluble solder paste
conducting eutectic reflow at 227C peak and have wetting issues.(first
3 images in PowerPoint).
We have checked plating thickness with our supplier and it meets spec.
EDX did not show any contamination, oxides etc. JEDEC solderability test
passed.
X-section shows some areas of missing nickel or gaps in coverage of base
copper. I need the experts to look at the images and comment if this
could be the root cause of poor wetting and non-wetting.
I have forwarded the PowerPoint to Steven Gregory to post on his
website.
Your feedback will be much appreciated.
Thank-you
Mumtaz Bora
Senior Quality Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
[log in to unmask]
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