Hi Mumtaz! I have a couple of questions and a couple of comments. Have you 
run a solderability test per JSTD-002 Test Method S and if so what was the 
result(s)? Has the customer been using that specific flux on these 
components in the past successfully? A couple of things to consider - (1) 
Pd is has a very slow diffusion rate (a couple orders of magnitude lower 
than gold) and increasing the reflow profile by 5C can make a significant 
difference; (2) NiPdAu surface finishes can have some flux sensitivity. I 
have found some fluxes that are less robust to NiPdAu surface finishes 
than others. Good Luck.

Dave Hillman
Rockwell Collins
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Subject
[TN] NiPdGold Plating Soldering Issues






Hello Technetters,
 
 
We have some SC70 packages with NiPd gold plating that have wetting
issues .
Customer is using Kester R596L tinlead water soluble solder paste
conducting  eutectic reflow at 227C peak and have wetting issues.(first
3 images in PowerPoint).
We have checked plating thickness with our supplier and it meets spec.
EDX did not show any contamination, oxides etc. JEDEC solderability test
passed. 
 
X-section shows some areas of missing nickel or gaps in coverage of base
copper. I need the experts to look at the images and comment if this
could be the root cause of poor wetting and non-wetting.
 
I have forwarded the PowerPoint to Steven Gregory to post on his
website.
 
Your feedback will be much appreciated.
 
Thank-you

Mumtaz Bora

Senior Quality Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

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