Hi Mumtaz!

It's been a long while since anybody has asked me to post anything on my webpage, TechNet has been pretty quiet for the last couple of months. I have been pretty quiet myself for awhile. I've had a lot of changes in my life recently.

Anyways, I have your PowerPoint posted, it's here:

http://stevezeva.homestead.com/Mumtaz.ppt

Sure looks like "head-in-pillow" to me.

Hope you have a good 2010.

Kind regards,

Steve Gregory
--- [log in to unmask] wrote:

From:         Mumtaz Bora <[log in to unmask]>
To:           [log in to unmask]
Subject: [TN] NiPdGold Plating Soldering Issues
Date:         Tue, 12 Jan 2010 14:56:12 -0800

Hello Technetters,
 
 
We have some SC70 packages with NiPd gold plating that have wetting
issues .
Customer is using Kester R596L tinlead water soluble solder paste
conducting  eutectic reflow at 227C peak and have wetting issues.(first
3 images in PowerPoint).
We have checked plating thickness with our supplier and it meets spec.
EDX did not show any contamination, oxides etc. JEDEC solderability test
passed. 
 
X-section shows some areas of missing nickel or gaps in coverage of base
copper. I need the experts to look at the images and comment if this
could be the root cause of poor wetting and non-wetting.
 
I have forwarded the PowerPoint to Steven Gregory to post on his
website.
 
Your feedback will be much appreciated.
 
Thank-you

Mumtaz Bora

Senior Quality Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]


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