Need help--
I have a question regarding pad adhesion to the substrate. I'm trying to locate some written material I can present regarding how much pad dhesion is lost for every heat cycle a board experiences. The substrate material is FR4.
Some background is that we are using a surface mount RF connector in a design that I feel is marginal at best. We originally were going to use a MCX connector and that is what the board was laid out to accommodate but found the need to use a MMCX connector due to physical size constraints. We are still using the old MCX land pattern (which I already know is not correct) and touching up the connector after reflow to add additional solder. This connector is on the primary side of the board so it is seeing 3 heat cycles minimum. What I'm trying to document is the degradation the pad adhesion is sustaining just using this process with no additional rework. My ultimate goal is to switch to a through hole connector. With the strain this connector sees there must be some mechanical strain relief, in my opinion, or we will be experiencing field failures.
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