It is, but I was referring to the benchtop models. I don't know a lot
about their larger systems.
R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Friday, January 08, 2010 10:09 AM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
Dean,
Yu da best!
Isn't this 'the other guys', however ...
A bit chilly up there again today? BTW - You needn't bother to send it
to
Michigan. I'm about ready for Spring now.
Thx
Steve C
-----Original Message-----
From: Dean Stadem [mailto:[log in to unmask]]
Sent: Friday, January 08, 2010 10:59 AM
To: 'TechNet E-Mail Forum'; 'Steven Creswick'; [log in to unmask]
Subject: RE: [TN] ULtrasonic Cleaning of PCBAs
Ta-da!
Ain't I a great resource, or what?
http://www.kandus.com/Configurations/33852%20Branson%208K.html
R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, January 07, 2010 12:57 PM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
Mark,
Whole heartedly agree! Aluminum is even worse/quicker in cavity/open
packages.
The variable sweep freq transducers that Richard references have helped
tremendously. I still proceed cautiously, however.
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D.
(Mark)
Sent: Thursday, January 07, 2010 10:27 AM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
Ultrasonic action can damage bondwired in OPEN PACKAGES, meaning metal
cans etc. The gold wires are quickly work hardened by the movement and
become brittle. That is not an issue with plastic encapsulated
components, because the bondwires need to be able to vibrate freely.
mark
mark
Mark Woolley
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Thursday, January 07, 2010 8:20 AM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
The company I worked for during the 1990's used Crest Ultrasonic
cleaning
equipment. The electronic manufacturing process methods were originally
designed by experts from Rockwell International in the late 1970s and
early
1980s. The products carried a 10 year warranty.
I was their Quality Manager. I tracked electronic failure data through
collected over 30 years.
There were only two instance of failures induced by Ultrasonic cleaning,
both related to a failure of the amplifiers which caused the transducers
to
output too much energy. This damaged reed switches and reed relays.
These
were not latent failures.
Guy
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Thursday, January 07, 2010 2:28 AM
To: [log in to unmask]
Subject: [TN] ULtrasonic Cleaning of PCBAs
Dear Technetters:
I have been posed a question that I don't have much experience with
other
than general knowledge. It there an ultrasonic cleaner system/setting
available that can clean printed circuit assemblies (yes will electronic
components)? With some pending designs there is a concern that our
board
houses will be able to sufficiently clean (deflux) under bottom only
components/BGA style components. I know from the standards that
ultrasonic
cleaning is typically limited to bare boards so as to not damage
internal
interconnections/wire bonds. But I am wondering if there is a low
setting
available to agitate the solution while not destroy/damage components?
Your thoughts are most appreciated.
Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation
1 Rocket Road | Hawthorne | CA | 90250
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