Hi Gregg! Just a couple of comments. Ultrasonic cleaning was viewed very
skeptically for many years as there was a concern that the ultrasonic
energy could cause damage at a component die/wirebond level for some
component constructions/configurations. A couple of researchers in the UK
(Richards/Foote were the authors I think - I have their report in the my
archives somewhere) did some foundation investigation demonstrating that
ultrasonic cleaning using 40 KHz transducers did not cause component
damage. And there has been additional process investigation since that
initial publication. You might check the IPC test methods and IPC cleaning
guideline standards for additional information.
Dave Hillman
Rockwell Collins
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Gregg Owens <[log in to unmask]>
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[TN] ULtrasonic Cleaning of PCBAs
Dear Technetters:
I have been posed a question that I don?t have much experience with other
than general knowledge. It there an ultrasonic cleaner system/setting
available that can clean printed circuit assemblies (yes will electronic
components)? With some pending designs there is a concern that our board
houses will be able to sufficiently clean (deflux) under bottom only
components/BGA style components. I know from the standards that ultrasonic
cleaning is typically limited to bare boards so as to not damage internal
interconnections/wire bonds. But I am wondering if there is a low setting
available to agitate the solution while not destroy/damage components?
Your thoughts are most appreciated.
Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation
1 Rocket Road | Hawthorne | CA | 90250
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