James,
I carried out work on this area a 2-3 years back as part of PCB
supplier/material qualification program - Phenolic base v's dicy base
laminates was reviewed, didn't come across phenolic base with fillers to the
best of my knowledge.
(Aside:  NP-170 (dicy) material had 15% inorganic filler material that
increased its Td value )
I was interested in the area of thermal performance (due tio lead free
reflow temp) & the material with higher Td (Decomposition temp) performed
better in my trials. 
Phenolic base should be in the region of 350 - 370 Deg C  - dicy base in the
region of 300 C. 
So it would be worthwhile comparing the phenolic material with filler's Td
to known values, also whether it a dicy base with filler material that is
posing as phenolic?

Regards
Paul O' Connor




On Mon, 4 Jan 2010 10:51:23 +0000, James Liddle <[log in to unmask]>
wrote:

>Hello
> 
>I'm looking for feedback with respect to writing a PWB Laminate
Specification that is tight enough to ensure consistent PWA performance and
reliability; but which is also flexible enough to ensure good
'Manufacturability'.
> 
>Up until now our Fabricator has used Isola IS410, which is a Phenolic
Laminate without Fillers that conforms to IPC-4101B Specification Sheets 124
and 129.  I'm quite happy to approve alternative manufacturer equivalents
which have the same composition and conform to the same Specification
Sheets;  ITEQ's IT-180 for example.  However, our Fabricator has a
preference for a Phenolic Laminate with Fillers, that conforms to IPC-4101B
Specification Sheets 99 and 126.
> 
>Am I being overly cautious if I deny their request for change?  Can anyone
report any adverse experiences they have had when making this change, that I
should be aware of?  Are there any differences in the properties or
characteristics of the two types of Laminates that I should pay particular
attention to?
> 
>Thanks
> 
>James Liddle 		 	   		  
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