Pete,

I agree. I wanted to know if Bills calculator would work on thermo
reliefs and could it be compared to the accuracy of the current formula.

After re-reading Bills original email I realize I may have
misunderstood, and the formula is for one via attached to nothing vs. a
via attached to a plane or copper pour.

Bill,

I guess you are not the only one who got busted in the assumption
department.

Thanks,

Ted T.

-----Original Message-----
From: Pete Houwen [mailto:[log in to unmask]] 
Sent: Wednesday, January 06, 2010 8:16 AM
To: [log in to unmask]; Tontis, Theodore
Subject: Re: Thermally Conductive & Plated Via Fill

Ted,

I doubt anyone has done the math on that, because you would be answering

two completely opposite questions.  Thermal relief holes are intended to

impede thermal transfer, thermal conducting holes aid thermal transfer.
So 
the question is, do you want that hole to conduct heat or not?  And if
you 
don't care, use a solid connection for better connectivity of the plane.


Pete

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