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January 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Wed, 6 Jan 2010 09:15:45 -0500
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I wouldn't say I general term.  There are good plating house (at least use to be) can plate low nickel with wire bondable gold that works well within the board shelf life. 
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Jan 06 09:14:12 2010
Subject: Re: [TN] Pull strength of thermosonic wire bondable gold

Hi Steve,
Nickel below 80-90 microinches will not act as a barrier due to porosity. You may get copper migration at 40 microinches of Ni which will effect bonding.
Regards
 
Aleks Lozinsky
Technical Sales Representative
Technic Canada Inc.
Office: 905-940-4020
Cell:  416-450-1093
E-mail: [log in to unmask]

-----Original Message-----
From: Steve Kelly <[log in to unmask]>
Date:         Wed, 6 Jan 2010 08:50:49 
To: <[log in to unmask]>
Subject: Re: [TN] Pull strength of thermosonic wire bondable gold

Hi Steve et al,
Unfortunately this is not as easy as it sounds. First the lower pull
strengths are not necessarily a failure- they are just not as good. This was
an experiment designed between ourselves and our customer. The initial
problem is we have a .0032 wide flying lead ( about 150 of them) with no
kapton support. A chip/die is "compression bonded" onto the lead - from what
I can gather it is a combination of heat/pressure/ultrasonic and some kind
of proprietary magic. The reason we went to the lower nickel is because the
leads being so fragile they often crack during the process so we tried the
lower nickel to alleviate this issue. With the lower nickel pull is approx.
5-7 grams. With the higher nickel 9-11 grams. There is a gold bump on the
die and when the failure happens the gold bump separates from the lead with
no damage to the gold bump. At present this is as much as I know. Thanks for
the input so far. Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: January-05-10 6:14 PM
To: [log in to unmask]
Subject: Re: [TN] Pull strength of thermosonic wire bondable gold

Steve,

If you can send me the data sets in an Excel format, I can provide you with
some insight based on magnitude and grouping by Weibull plot.  

If there is a big mix of failure modes, this interpretation will be pretty
generic.  

Its free input, however   :-)

Just send it direct.

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Tuesday, January 05, 2010 4:17 PM
To: [log in to unmask]
Subject: [TN] Pull strength of thermosonic wire bondable gold

Hi All,

I have a wire bond question to the wire bond gurus who have helped me out a
lot in the past. Made 2 versions of a flex circuit - only varied the nickel
thickness. Application is thermosonic gold wire bonding.

Flex circuit lead is .0032 wide - version 1 - nickel is 150 microinches -
soft gold is 50 microinches- pull strength is X

                                                        Version 2 - nickel
is 40 microinches - soft gold is 50 microinches - pull strength is approx.
½X  of version 1-

Is this what I should expect?



Regards Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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