TECHNET Archives

January 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Pete Houwen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Pete Houwen <[log in to unmask]>
Date:
Wed, 6 Jan 2010 08:15:44 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Ted,

I doubt anyone has done the math on that, because you would be answering 
two completely opposite questions.  Thermal relief holes are intended to 
impede thermal transfer, thermal conducting holes aid thermal transfer.  So 
the question is, do you want that hole to conduct heat or not?  And if you 
don't care, use a solid connection for better connectivity of the plane.  

Pete

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2