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January 2010

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Wed, 6 Jan 2010 14:14:12 +0000
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Hi Steve,

Nickel below 80-90 microinches will not act as a barrier due to porosity. You may get copper migration at 40 microinches of Ni which will effect bonding.

Regards

 

Aleks Lozinsky

Technical Sales Representative

Technic Canada Inc.

Office: 905-940-4020

Cell:  416-450-1093

E-mail: [log in to unmask]



-----Original Message-----

From: Steve Kelly <[log in to unmask]>

Date:         Wed, 6 Jan 2010 08:50:49 

To: <[log in to unmask]>

Subject: Re: [TN] Pull strength of thermosonic wire bondable gold



Hi Steve et al,

Unfortunately this is not as easy as it sounds. First the lower pull

strengths are not necessarily a failure- they are just not as good. This was

an experiment designed between ourselves and our customer. The initial

problem is we have a .0032 wide flying lead ( about 150 of them) with no

kapton support. A chip/die is "compression bonded" onto the lead - from what

I can gather it is a combination of heat/pressure/ultrasonic and some kind

of proprietary magic. The reason we went to the lower nickel is because the

leads being so fragile they often crack during the process so we tried the

lower nickel to alleviate this issue. With the lower nickel pull is approx.

5-7 grams. With the higher nickel 9-11 grams. There is a gold bump on the

die and when the failure happens the gold bump separates from the lead with

no damage to the gold bump. At present this is as much as I know. Thanks for

the input so far. Steve Kelly



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick

Sent: January-05-10 6:14 PM

To: [log in to unmask]

Subject: Re: [TN] Pull strength of thermosonic wire bondable gold



Steve,



If you can send me the data sets in an Excel format, I can provide you with

some insight based on magnitude and grouping by Weibull plot.  



If there is a big mix of failure modes, this interpretation will be pretty

generic.  



Its free input, however   :-)



Just send it direct.



Steve C



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly

Sent: Tuesday, January 05, 2010 4:17 PM

To: [log in to unmask]

Subject: [TN] Pull strength of thermosonic wire bondable gold



Hi All,



I have a wire bond question to the wire bond gurus who have helped me out a

lot in the past. Made 2 versions of a flex circuit - only varied the nickel

thickness. Application is thermosonic gold wire bonding.



Flex circuit lead is .0032 wide - version 1 - nickel is 150 microinches -

soft gold is 50 microinches- pull strength is X



                                                        Version 2 - nickel

is 40 microinches - soft gold is 50 microinches - pull strength is approx.

½X  of version 1-



Is this what I should expect?







Regards Steve Kelly







Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)



(416) 750-8433 (work)



(416) 750-0016 (fax)



(416) 577-8433 (cell)









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