Steve,

If you can send me the data sets in an Excel format, I can provide you with
some insight based on magnitude and grouping by Weibull plot.  

If there is a big mix of failure modes, this interpretation will be pretty
generic.  

Its free input, however   :-)

Just send it direct.

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Tuesday, January 05, 2010 4:17 PM
To: [log in to unmask]
Subject: [TN] Pull strength of thermosonic wire bondable gold

Hi All,

I have a wire bond question to the wire bond gurus who have helped me out a
lot in the past. Made 2 versions of a flex circuit - only varied the nickel
thickness. Application is thermosonic gold wire bonding.

Flex circuit lead is .0032 wide - version 1 - nickel is 150 microinches -
soft gold is 50 microinches- pull strength is X

                                                        Version 2 - nickel
is 40 microinches - soft gold is 50 microinches - pull strength is approx.
½X  of version 1-

Is this what I should expect?



Regards Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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