Hi Steve
 
Your question brings up questions.  Are the bonds, which are being  tested 
and failing, stitch or ball? Can you notice any physical differences in  the 
failures? Also what type of nickel plating are you using? It might be  that 
a higher stressed nickel is fracturing in bonding and setting up  the site 
to fail. 
 
Cheers,
Joe    
 
 
In a message dated 1/5/2010 1:18:08 P.M. Pacific Standard Time,  
[log in to unmask] writes:

Hi  All,

I have a wire bond question to the wire bond gurus who have helped  me out 
a lot in the past. Made 2 versions of a flex circuit - only varied the  
nickel thickness. Application is thermosonic gold wire bonding.

Flex  circuit lead is .0032 wide - version 1 - nickel is 150 microinches - 
soft gold  is 50 microinches- pull strength is X

Version 2 - nickel is 40 microinches - soft gold is 50  microinches - pull 
strength is approx. ½X  of version 1-

Is this  what I should expect?



Regards Steve Kelly



Steve  Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433  (work)

(416) 750-0016 (fax)

(416) 577-8433  (cell)




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