TECHNET Archives

January 2010

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Pull strength of thermosonic wire bondable gold
From:
Steve Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Kelly <[log in to unmask]>
Date:
Tue, 5 Jan 2010 15:16:53 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (37 lines) 
Hi All,

I have a wire bond question to the wire bond gurus who have helped me out a lot in the past. Made 2 versions of a flex circuit - only varied the nickel thickness. Application is thermosonic gold wire bonding.

Flex circuit lead is .0032 wide - version 1 - nickel is 150 microinches - soft gold is 50 microinches- pull strength is X

                                                        Version 2 - nickel is 40 microinches - soft gold is 50 microinches - pull strength is approx. ½X  of version 1-

Is this what I should expect?



Regards Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2