Joyce,
If your asking if we are using the same paste and profile as the
previous manufacture, I don't know. But I highly doubt it, the only
constants here are, same board, same parts and same stencil.
Rob Strecker
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, January 27, 2010 9:35 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Ball Under Chip Cap
Are you use the same paste and same reflow profile?
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Jan 27 11:13:24 2010
Subject: [TN] Solder Ball Under Chip Cap
We recently received a call from one of our customers that their boards
are failing Hi-Pot test. They sent us a picture of a solder ball under
one of the chip caps (package 1825). Apparently it's present on all 50
boards we built and always in the same place. We are using leaded paste
for this build and the stencil we received was from the previous
manufacture who could not fix the problem and went to hand soldering the
part (info we got after the fact). I have inspected the stencil and it
looks fine. The apertures are a 1:1, so the only thing I can think of
is getting a reduction of some kind on the stencil. I will send the
picture to Steve to get it posted.
Thanks,
Rob Strecker
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