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January 2010

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Subject:
Minimum Solder Masking on Test Point and Vias
From:
Gobinathan Athimolom <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gobinathan Athimolom <[log in to unmask]>
Date:
Tue, 5 Jan 2010 01:05:32 -0600
Content-Type:
text/plain
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text/plain (24 lines) 
Hi folks!

What is an ideal or a rule of thumb for solder mask opening on test point or via 
for PCB? Let say the test point/via copper diameter is 0.5mm, what is a 
recommended solder mask opening? 

Is there an IPC standard for solder mask opening for test point and via? Mainly 
for accessibility using in-circuit (bed-of-nail) test approach. 

Appreciate any kind of inputs. Thanks.

Cheers!
Gobi

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