Just wanted to put out there - THANKS to those who contribute to this forum. I learn something every week and have gotten answers to some sticky questions making my job easier. It's so empowering to know we have such experts who can actually communicate and be so technically right on! 

Thanks to you!

Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Friday, January 22, 2010 11:32 AM
To: [log in to unmask]
Subject: Re: [TN] X-Ray Inspection

Ashok,
No, this should not be "normal". This is usually a sign of warpage - the board, the part or both. Even if things pass electrical test you may have head on pillow defects waiting to bit you in the bum when the product is with customers. Do some cross-sectioning. And if you can,  warpage measurements as a function of temperature.  
Bev
RIM 

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri Jan 22 14:22:19 2010
Subject: Re: [TN] X-Ray Inspection

Bob

We are currently doing XRAY Inspection of BGAs. The XRAY TestEngineer
noticed that solder ball size on outer rows is different from the ball size
on inner core areas. 
"We are still seeing a bi-modal data distribution of ball volume between the
middle and periphery balls? Is that normal for BGAs. "

I would appreciate your expert comments as there is not much XRAY related
information on web.

Regards

Ashok Dhawan
Manuf. Specialist
Parker hannifin Electronic Controls
Winnipeg Canada
[log in to unmask]

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