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January 2010

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Subject:
From:
Chris Mahanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Mahanna <[log in to unmask]>
Date:
Thu, 21 Jan 2010 09:51:24 -0500
Content-Type:
text/plain
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text/plain (208 lines)
Mumtaz,
Note that the Ni skips are on the tensile side of the lead only, not the compression side.  The lead was formed after finish plating, and the Ni was pulled apart (Pd and Au too).  It looks like it is breaking at the thin spots caused by the surface of the lead?
This is a common cause of poor wetting.

Vlad,
There is a little debate within 6012/2221/455X now about quality assurance of ENEPIG for wire bonding.  The idea would be for the Au to be on the thickness high-end of what's possible.  6012C weasel worded it.  2221B pointed to pull testing.  As I understand it, 455X is leaning towards XRF.  I don't personally know of a capable XRF/ standard.  Any ideas?  I suggested that maybe FIB mill + SEM might work better and be more available than $150k XRFs, but I haven't tried it.

Chris

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Wednesday, January 13, 2010 5:28 PM
To: [log in to unmask]
Subject: Re: [TN] NiPdGold Plating Soldering Issues

Hello Vladimir,

The Nickel plating thickness was measured using SEM. Palldium and Gold were measured using XRF.


 


Mumtaz Bora

Senior Quality Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]

 SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference and exhibition devoted to electronics assembly.  Visit www.smta.org/smtai for full details.

 
For a free exhibit pass:
http://smta.org/smtai/Free_Exhibits_Pass_SMTAI.pdf 
 

-----Original Message-----
From: vladimir Igoshev [mailto:[log in to unmask]]
Sent: Wednesday, January 13, 2010 1:10 PM
To: TechNet E-Mail Forum; Mumtaz Bora
Subject: Re: [TN] NiPdGold Plating Soldering Issues

Mumtaz,

One can not measure such thin layers (Au in particular) with SEM, unless the sample was specially prepared (overplated with Ni). Did you do that?

Regards,

Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Mumtaz Bora <[log in to unmask]>
Date:         Wed, 13 Jan 2010 12:07:49 
To: <[log in to unmask]>
Subject: Re: [TN] NiPdGold Plating Soldering Issues

Hi Victor,

Yes, I have SEM/EDX images of the component. SEM was used for plating thickness measurements . Base material is copper. No idea on the dwell time from Nickel to Gold. 


Mumtaz Bora

Senior Quality Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]

 SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference and exhibition devoted to electronics assembly.  Visit www.smta.org/smtai for full details.

 
For a free exhibit pass:
http://smta.org/smtai/Free_Exhibits_Pass_SMTAI.pdf 
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, January 13, 2010 6:49 AM
To: [log in to unmask]
Subject: Re: [TN] NiPdGold Plating Soldering Issues

Do you have SEM/EDX photos of this sample/cross section?
What instrument was used to measure the plating?  XRF or SEM What is base material?
Dwell time from nickel to Au plating?


Vic,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, January 12, 2010 6:23 PM
To: [log in to unmask]
Subject: Re: [TN] NiPdGold Plating Soldering Issues

Hi Mumtaz!

It's been a long while since anybody has asked me to post anything on my webpage, TechNet has been pretty quiet for the last couple of months. I have been pretty quiet myself for awhile. I've had a lot of changes in my life recently.

Anyways, I have your PowerPoint posted, it's here:

http://stevezeva.homestead.com/Mumtaz.ppt


Sure looks like "head-in-pillow" to me.

Hope you have a good 2010.

Kind regards,

Steve Gregory
--- [log in to unmask] wrote:

From:         Mumtaz Bora <[log in to unmask]>
To:           [log in to unmask]
Subject: [TN] NiPdGold Plating Soldering Issues
Date:         Tue, 12 Jan 2010 14:56:12 -0800

Hello Technetters,
 
 
We have some SC70 packages with NiPd gold plating that have wetting issues .
Customer is using Kester R596L tinlead water soluble solder paste conducting  eutectic reflow at 227C peak and have wetting issues.(first
3 images in PowerPoint).
We have checked plating thickness with our supplier and it meets spec.
EDX did not show any contamination, oxides etc. JEDEC solderability test passed. 
 
X-section shows some areas of missing nickel or gaps in coverage of base copper. I need the experts to look at the images and comment if this could be the root cause of poor wetting and non-wetting.
 
I have forwarded the PowerPoint to Steven Gregory to post on his website.
 
Your feedback will be much appreciated.
 
Thank-you

Mumtaz Bora

Senior Quality Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]


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