I was always trained during my early years working with the Cat A under
the WS6536, DoD Std 2000, etc days that Bev stated to reduce tin pest.
I was informed that during the cold war in the 70's that line of radars
were installed in the northern part of Canada to detect incoming
missiles attacks. The extreme cold temperature caused solder failures
related to tin pest or was attributed to tin pest. I believe my Cat A
without question. Anyone else remember being told that? I am one of the
older ones here. Jon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, January 20, 2010 9:56 AM
To: [log in to unmask]
Subject: Re: [TN] Antimony in solder
Graham,
I think it was historically added because of a fear of tin pest. Which
is weird since lead is an excellent deterrent to tin pest.
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nigel Burtt
Sent: Wednesday, January 20, 2010 10:51 AM
To: [log in to unmask]
Subject: Re: [TN] Antimony in solder
Antimony affects wetting speed
Useful reference here:
http://www.kester.com/en-us/documentation/EffectsofMetallicImpurities.pd
f
Nigel
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