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January 2010

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Subject:
Re: TI MSP Early Life Failure?
From:
Nigel Burtt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
Date:
Wed, 20 Jan 2010 09:25:13 -0600
Content-Type:
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What PCB laminate material is this. Have seen in the past CAF like problem 
without the normal bias or time expected under certain conditions with one 
particular laminate and close via spacing like this. Like you, the symptoms 
initially pointed to a bad lot of ICs...

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