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January 2010

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Subject:
Re: TI MSP Early Life Failure?
From:
Randall L Bock <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Randall L Bock <[log in to unmask]>
Date:
Tue, 19 Jan 2010 11:18:28 -0500
Content-Type:
text/plain
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text/plain (46 lines) 
Do not have an answer to your question,  but Warner was getting worried. TechNet is alive..


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Tuesday, January 19, 2010 11:13 AM
To: [log in to unmask]
Subject: [TN] TI MSP Early Life Failure?

Hello Technet,
We are working on a failure analysis of a battery operated remote sensing device.  Failure is linked to 500ohm short power/ground.  The assembly experiences at least (2) 255C reflow thermal excursions.  Failure manifests at ~6 months.
Slicing/dicing isolation yielded: breakdown between two vias (17 mil spacing) and/or MSP input impedance.  Beyond that, original evidence is lost.
We are working the CAF theory, however reproduction of the problem is proving difficult, possibly due to the low number of opportunities on the actual board.
For those of you who know that I'm pushing for placement of (the new) CAF coupons on panels, yes this is our most recent example of the problem.

I would like to get feedback on the possibility that it was the microcontroller instead...

TI MSP430F1612
Level-3-260C-168 HR


Thanks!

Chris Mahanna
Robisan Laboratory Inc.

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