Bev,
I did find some info but you need to read this carefully. The testing was
on Flux Residue in general, not just No Clean. Some of the residues
contained greenish compounds showing etching. Holy cow, all kinds of ionic
compounds must exist.
http://findarticles.com/p/articles/mi_qa3776/is_200010/ai_n8904617/?tag=cont
ent;col1
Some of the info I found was simply "Marketing Drool" from vendors of
cleaning equipment. I do not expect a balanced review of issues there.
I will keep looking, let me know if you have any good links.
Thanks,
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, January 18, 2010 11:46 AM
To: [log in to unmask]
Subject: Re: [TN] Low standoff module cleaning
Bob,
It depends on high high frequency is. Please check out three papers from an
APEX of about 4 years ago. Dr. Laura Turbini was the author of one of them I
believe and Alpha produced one of the other ones.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Monday, January 18, 2010 11:20 AM
To: [log in to unmask]
Subject: Re: [TN] Low standoff module cleaning
Hi,
I also noticed a note on page 12:
"Neither via-holes nor wires are allowed on the PCB upper layer in area
occupied by the module."
I guess this implies traces and through holes are located on the part
underside.
If using NC is unacceptable as NC might affect high frequency operation (not
something I really believe) and if other fluxes can not be cleaned without
some kind of spacing lead attachment, then are we are saying this component
is not useable as provided?
Wow, I think we should step back and re-think before we claim the design of
this component is seriously compromised.
Did I miss something here?
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, January 18, 2010 11:01 AM
To: [log in to unmask]
Subject: Re: [TN] Low standoff module cleaning
We use these parts in Hi-Rel applications, but we have a local company
perform compliant lead attachment prior to our assembling the components.
They use a laser soldering system to perform the compliant lead attachment,
so the part is not heated up. If you want to contact them here is their
website www.analog-tech.com.
The parts cannot be soldered reliably without compliant lead attachment,
even with a thicker stencil. The resultant solder joints when soldering
directly to the pads are known to fail after about 1000 cycles, due to the
large delta CTE.
Also, the compliant leads did not affect the performance of the package from
a signal impedance standpoint, but the reliability is about 10X better. With
the compliant leads, you can clean under the part. NC flux will affect the
performance of the package.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, January 18, 2010 9:27 AM
To: [log in to unmask]
Subject: [TN] Low standoff module cleaning
Dear Technos,
How many of you would solder this other than no-clean, see the -A2 option on
page 7?
www.meshnetics.com/ZigBit_OEM_Module_Product_Datasheet.pdf
The assembled board needs to be conformally coated and will work outdoors,
-25C to 60C range.
One solution would be to bump the pads of the part with a thick stencil, but
how high the part has to stand on the board to ensure good wash?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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