John,
Ditto here.
I can only see an OA flux wicking under the component and into any
vias/traces on the component underside. I assume these exist from notes on
page 12.
My understanding is you can not clean that OA under the package out.
Thanks,
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Goulet
Sent: Monday, January 18, 2010 12:29 PM
To: [log in to unmask]
Subject: Re: [TN] Low standoff module cleaning
I looked at the drawing which shows it sits flush to the board. Checking all
the reference documentation there were no assembly recommendations relative
to flux, cleaning nor were there any reflow temperature specifications
given.
No-clean flux residue has the potential to effect the signal's performance
at 2.4 Gig Hz but it appears to be the only choice since you could locally
clean the leads since they are all on the perimeter. I would test a few
proto types to see if cleaning was required based on the application.
The risk of using an OA paste would be too great with no bottom clearance,
other than pad thickness, and moisture entrapment underneath could be
disastrous as well. The assembly specification isn't very informative.
Laser soldering of this device seems to be the best solution since you
have the pin level control in the soldering process.
Just my thoughts, I hope I didn't miss something.
----- Original Message -----
From: "Richard D. Stadem" <[log in to unmask]>
To: [log in to unmask]
Sent: Monday, January 18, 2010 11:00:35 AM GMT -05:00 US/Canada Eastern
Subject: Re: [TN] Low standoff module cleaning
We use these parts in Hi-Rel applications, but we have a local company
perform compliant lead attachment prior to our assembling the components.
They use a laser soldering system to perform the compliant lead attachment,
so the part is not heated up. If you want to contact them here is their
website www.analog-tech.com.
The parts cannot be soldered reliably without compliant lead attachment,
even with a thicker stencil. The resultant solder joints when soldering
directly to the pads are known to fail after about 1000 cycles, due to the
large delta CTE.
Also, the compliant leads did not affect the performance of the package from
a signal impedance standpoint, but the reliability is about 10X better. With
the compliant leads, you can clean under the part. NC flux will affect the
performance of the package.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, January 18, 2010 9:27 AM
To: [log in to unmask]
Subject: [TN] Low standoff module cleaning
Dear Technos,
How many of you would solder this other than no-clean, see the -A2 option on
page 7?
www.meshnetics.com/ZigBit_OEM_Module_Product_Datasheet.pdf
The assembled board needs to be conformally coated and will work outdoors,
-25C to 60C range.
One solution would be to bump the pads of the part with a thick stencil, but
how high the part has to stand on the board to ensure good wash?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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