We use these parts in Hi-Rel applications, but we have a local company perform compliant lead attachment prior to our assembling the components. They use a laser soldering system to perform the compliant lead attachment, so the part is not heated up. If you want to contact them here is their website www.analog-tech.com.
The parts cannot be soldered reliably without compliant lead attachment, even with a thicker stencil. The resultant solder joints when soldering directly to the pads are known to fail after about 1000 cycles, due to the large delta CTE.
Also, the compliant leads did not affect the performance of the package from a signal impedance standpoint, but the reliability is about 10X better. With the compliant leads, you can clean under the part. NC flux will affect the performance of the package.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, January 18, 2010 9:27 AM
To: [log in to unmask]
Subject: [TN] Low standoff module cleaning

Dear Technos,

 

How many of you would solder this other than no-clean, see the -A2 option on page 7?

 

www.meshnetics.com/ZigBit_OEM_Module_Product_Datasheet.pdf

 

The assembled board needs to be conformally coated and will work outdoors, -25C to 60C range.

 

One solution would be to bump the pads of the part with a thick stencil, but how high the part has to stand on the board to ensure good wash?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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