I generated the conceptual design for a batch cleaner and then Kyzen in Manchester NH generated the final design. We purchased several units for several of our manufacturing facilities after having successfully used the first two in our NH facility for several years. The spray under immersion cleaning system allows us to clean a batch of boards every 10 minutes and this system eliminated the issues listed in these E-mails related to ultrasonic cleaners.
The batch cleaner using a saponifer allows cleaning under micro BGAs and to clean boards that are going to be conformal coated.
The batch cleaner can be used to deflux under micro BGAs in production or after replacement for No-Clean flux that can cause signal integrity issues when in the gigaHz range due to capacitance from flux residues. The boards have to be immediately washed in the aqueous cleaner to remove all the saponifer. Obviously this work is done prior to placing switches, speakers etc that are not aqueous compatible.
John Goulet
Sr Process Engineer
----- Original Message -----
From: "Gregg Owens" <[log in to unmask]>
To: [log in to unmask]
Sent: Friday, January 8, 2010 11:54:55 AM GMT -05:00 US/Canada Eastern
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
Have to say a big thank you to TechNet! Your thoughts have been passed onto the appropriate engineers. All I can say is you make me look smart knowing the right people to contact. So you have all started my 2010 in a very nice way.... 8-{)}
Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation
-----Original Message-----
From: Dean Stadem [mailto:[log in to unmask]]
Sent: Friday, January 08, 2010 7:59 AM
To: 'TechNet E-Mail Forum'; 'Steven Creswick'; Gregg Owens
Subject: RE: [TN] ULtrasonic Cleaning of PCBAs
Ta-da!
Ain't I a great resource, or what?
http://www.kandus.com/Configurations/33852%20Branson%208K.html
R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, January 07, 2010 12:57 PM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
Mark,
Whole heartedly agree! Aluminum is even worse/quicker in cavity/open
packages.
The variable sweep freq transducers that Richard references have helped
tremendously. I still proceed cautiously, however.
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D.
(Mark)
Sent: Thursday, January 07, 2010 10:27 AM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
Ultrasonic action can damage bondwired in OPEN PACKAGES, meaning metal
cans etc. The gold wires are quickly work hardened by the movement and
become brittle. That is not an issue with plastic encapsulated
components, because the bondwires need to be able to vibrate freely.
mark
mark
Mark Woolley
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Thursday, January 07, 2010 8:20 AM
To: [log in to unmask]
Subject: Re: [TN] ULtrasonic Cleaning of PCBAs
The company I worked for during the 1990's used Crest Ultrasonic
cleaning
equipment. The electronic manufacturing process methods were originally
designed by experts from Rockwell International in the late 1970s and
early
1980s. The products carried a 10 year warranty.
I was their Quality Manager. I tracked electronic failure data through
collected over 30 years.
There were only two instance of failures induced by Ultrasonic cleaning,
both related to a failure of the amplifiers which caused the transducers
to
output too much energy. This damaged reed switches and reed relays.
These
were not latent failures.
Guy
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Thursday, January 07, 2010 2:28 AM
To: [log in to unmask]
Subject: [TN] ULtrasonic Cleaning of PCBAs
Dear Technetters:
I have been posed a question that I don't have much experience with
other
than general knowledge. It there an ultrasonic cleaner system/setting
available that can clean printed circuit assemblies (yes will electronic
components)? With some pending designs there is a concern that our
board
houses will be able to sufficiently clean (deflux) under bottom only
components/BGA style components. I know from the standards that
ultrasonic
cleaning is typically limited to bare boards so as to not damage
internal
interconnections/wire bonds. But I am wondering if there is a low
setting
available to agitate the solution while not destroy/damage components?
Your thoughts are most appreciated.
Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation
1 Rocket Road | Hawthorne | CA | 90250
[log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
