IPC-600-6012 Archives

January 2010

IPC-600-6012@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Roberto Tulman <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Fri, 29 Jan 2010 09:03:37 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (87 lines)
Hi John,
I could be interesting to get more data about this cross-section, what
is the material, Tg, Td, was it pre-baked, was it thermal stressed
(Xtimes, temp?)
I don't believe this needs to be addressed separately in the 6012/600
Agree with Werner : this lead-free world is challenging
Roberto 


 Roberto Tulman
 VP Technologies & CTO
 Eltek Ltd 
 [log in to unmask] | www.eltekglobal.com
 Tel: +972 3 939 5004 | Fax: +972 3 939 3704 |Cell: +972 54 8074204


-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Friday, January 29, 2010 4:09 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Bundle Crack in Microsection

isnt this crazing (or a cousin of...)  ??
i'd be interested to see the area of interest at higher mag, to see if
the crack goes thru an actual glass fiber or not.
i've seen cracks induced by sectioning (aggressive grinding/polishing)
where individual glass bundles are cut in half.
as to possible caf paths, couldnt measles and/or crazes act as such, yet
neither one is rejectable.

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



John Perry <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]> 01/28/2010 07:35 PM Please
respond to "(Combined Forum of D-33a and 7-31a Subcommittees)"
<[log in to unmask]>


To
[log in to unmask]
cc

Subject
[IPC-600-6012] Bundle Crack in Microsection






Hi Everyone,

We've got a request for feedback on the anomaly in the attached .ppt
file 
which was detected in one bundle of glass in a coupon.  This is in the 
center of the board stack, which is a 24 layer construction.  Since it
is 
in the core material it may be related to glass non-wetting of the resin

or poor glass treatment.

I'd also like to know if this is something we can consider developing 
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las 
Vegas in a couple months.

Regards,

John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org

ATOM RSS1 RSS2