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Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Fri, 29 Jan 2010 09:03:37 +0200 |
Content-Type: | text/plain |
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Hi John,
I could be interesting to get more data about this cross-section, what
is the material, Tg, Td, was it pre-baked, was it thermal stressed
(Xtimes, temp?)
I don't believe this needs to be addressed separately in the 6012/600
Agree with Werner : this lead-free world is challenging
Roberto
Roberto Tulman
VP Technologies & CTO
Eltek Ltd
[log in to unmask] | www.eltekglobal.com
Tel: +972 3 939 5004 | Fax: +972 3 939 3704 |Cell: +972 54 8074204
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Friday, January 29, 2010 4:09 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Bundle Crack in Microsection
isnt this crazing (or a cousin of...) ??
i'd be interested to see the area of interest at higher mag, to see if
the crack goes thru an actual glass fiber or not.
i've seen cracks induced by sectioning (aggressive grinding/polishing)
where individual glass bundles are cut in half.
as to possible caf paths, couldnt measles and/or crazes act as such, yet
neither one is rejectable.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
John Perry <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]> 01/28/2010 07:35 PM Please
respond to "(Combined Forum of D-33a and 7-31a Subcommittees)"
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Subject
[IPC-600-6012] Bundle Crack in Microsection
Hi Everyone,
We've got a request for feedback on the anomaly in the attached .ppt
file
which was detected in one bundle of glass in a coupon. This is in the
center of the board stack, which is a 24 layer construction. Since it
is
in the core material it may be related to glass non-wetting of the resin
or poor glass treatment.
I'd also like to know if this is something we can consider developing
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las
Vegas in a couple months.
Regards,
John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
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www.ipc.org
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