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January 2010

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Thu, 21 Jan 2010 18:44:35 +0000
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Steve, 



Take a look at how much lead prices have gone up in that same time. 



Mike Buetow

Editor in Chief

Circuits Assembly

w/m 617-327-4702



The 2009 Directory of EMS Companies -- More than 1850 listings, and now in Excel!



-----Original Message-----

From:         "Whittaker, Dewey (EHCOE)" <[log in to unmask]>

Date:         Thu, 21 Jan 2010 07:02:43 

To: <[log in to unmask]>

Subject: Re: [LF] Fodder for Discussion?



We oughta divorce those tin pests and get our share of the antimony.

Dewey



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Steve Gregory

Sent: Thursday, January 21, 2010 6:36 AM

To: [log in to unmask]

Subject: Re: [LF] Fodder for Discussion?



One thing is a fact, just ten years ago tin was around $5,000 a tonne,

then

started a meteoric climb around 2005 and peaked to almost $26,000 just

before the global recession. 



It then dropped to around $11,000 a tonne at the beginning of the

recession

but has started its climb once again. It's now at around $18,000 a

tonne.



Somebody is making some real money from lead-free...



Steve



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of James, Chris

Sent: Thursday, January 21, 2010 6:10 AM

To: [log in to unmask]

Subject: Re: [LF] Fodder for Discussion?



I'm not going to argue the pro's and con's but I don't think you can

call lead free solder sub standard any more than you can call lead free

petrol substandard.



If you use/apply either "incorrectly" you will end up with a problem.

IMO if the Xbox had been designed correctly and assembled correctly then

the problems would not have arisen. Many companies are successfully

manufacturing a wide range of technologies using lead free solder.



Who is to say that even if the Xbox used sn/pb solder it still would not

have suffered from a thermal management issue. The product gets used in

a wide range of ambient temperatures, compounded by varying enclosures

and levels of cleanliness, so thermal management needs the utmost

consideration.



Leadfree is here, the global markets requiring it outstrip those that

still don't but the momentum is still gathering, so anyone still with a

small minded jaundiced opinion on it needs to step back and take a

reality check and move on.



Chris







-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Marcus L. Thompson

Sent: 20 January 2010 17:39

To: [log in to unmask]

Subject: Re: [LF] Fodder for Discussion?



Points well made, Nigel, particularly in consideration of the apparent 

intellectual capacity of ranking Microsoft personnel: I have no doubt 

that the selected Chinese manufacturing entity (my assumption, as I've 

never even seen one of the units myself) was "carefully" chosen to 

fulfill the "target objectives" set forth by corporate management.



The funniest thing about this particular case (again, I might be wrong 

here) is the fact that lead-free was chosen to produce the device well 

before EU import requirements were put into effect.  So, one could 

assume that a hamstrung and crunched design department probably missed 

the thermomechanical mark for the application; and created a product 

which would have performed satisfactorily if it had not been constructed



with what amounts to substandard solder...



Case closed?







--- Previous Message in This Thread ---

Subject: Re:[LF] Fodder for Discussion?

From: Nigel Burtt <[log in to unmask]>

To: [log in to unmask]

Date: Wednesday, January 20, 2010 2:20:55 AM



> I was going to say much the same thing as Jean-Paul (only less

eloquently) 

> having read the first few posts There are two obvious possible causes

here:

> 

> (1) the use of lead-free solder

> (2) poor design for reliability, failing to account for

thermo-mechanical aspects

> 

> Given this is a first mass-produced product for Microsoft (a computer

software 

> company with no track-record in similar hardware on the world market)

I know 

> which one I would be more inclined to point the finger at. The other

is 

> probably a contributing factor, at least in as far as a full and

proper 

> understanding of its performance and the manufacturing process

controls 

> necessary to guarantee the required level of performance for the

design.

> 

> Nigel Burtt

> Enjaybee Associates

> www.nigelburtt.co.uk

> 

>

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